Dr. David Yan
Associate Professor
Email: david.yan@sjsu.edu
Telephone: (408) 924-3222
Office Hours: Thursday 10:00 AM - 12:00 PM
Office Location: IS 101
Education
- Ph.D. Deakin University, Australia, 2014
- M.Phil. (1st Hons) Auckland University of Technology, New Zealand, 2009
- B.E. (Hons) Mechanical Engineering, Auckland University of Technology, New Zealand, 2007
Bio
Dr. David Yan joined the Department of Aviation & Technology at San José State University as an Assistant Professor in August 2017. Prior to that, he worked as an Assistant Professor (tenure-track) of Mechanical Engineering Technology at University of Wisconsin-Green Bay, WI.
His research interests & engineering expertise include: 1) Friction Stir Welding & Processing, 2) High-speed Machining, 3) Additive Manufacturing, and 5) Computer-aided Design and Manufacturing. His long-term goal is to develop a fundamental understanding of the process mechanisms involved in the hybrid additive manufacturing-machining of advanced aerospace alloys and space materials, and their relationship with the microstructural characteristics and critical properties of the final product. These efforts are part of an ongoing quest to identify innovations that enhance hybrid process efficiency and product quality.
To date, he has authored more than 20 publications including books, journal papers and peer-reviewed conference proceedings. He has also been serving for The Minerals, Metals & Materials Society (TMS) as a Technical Committee Member in the Additive Manufacturing, Shaping & Forming, Powder Materials, Electronic Packaging & Interconnection Materials and Titanium Committee, as well as a Gust Editor of JOM (The Member Journal of TMS) and Symposium Co-organizer since 2016.
He received his B.E. (Hons) and M.Phil. (1st Hons) in Mechanical Engineering from Auckland University of Technology, New Zealand in 2007 and 2009 respectively. He earned his Ph.D. from Deakin University, Australia in 2014 (visiting Ph.D. candidate from 2011-2013 at Ontario Tech University, Canada).
