Research & Scholarly Activity
Research & Scholarly Activity
- Adhesion and bonding mechanisms
2005-3000Description: null
- Advanced Stent Development, Advanced Cardiovascula
2005-3000Description: Advanced Stent Development, Advanced Cardiovascular Systems, Inc.
- Alternate Lead Free Alloys, Sjsu Foundation
2005-3000Description: Alternate Lead Free Alloys, SJSU Foundation
- Characterization Of Glass Substrates For Hard Driv
2005-3000Description: Characterization of Glass Substrates for Hard Drive Applications, Seagate Technology
- Collaborative For Disaster Mitigation Implementati
2005-3000Description: Collaborative for Disaster Mitigation Implementation Grant, Federal Emergency Management Agency
- College Of Engineering Recognition Award, Sjsu Col
2005-3000Description: College of Engineering Recognition Award, SJSU College of Engineering
- Computer Modeling Of Solder Joint Fatigue Life For
2005-3000Description: Computer Modeling of Solder Joint Fatigue Life for μSMD Structures, National Semiconductor Corporation
- Corrosion Evaluation Of Heat Exchanger Tubing, Pac
2005-3000Description: Corrosion Evaluation of Heat Exchanger Tubing, Pacific Gas & Electric Company
- Corrosion Testing Of Condenser Tube Materials At G
2005-3000Description: Corrosion Testing of Condenser Tube Materials at Geysers Power Plant, Pacific Gas & Electric Company
- Corrosion phenomen
2005-3000Description: null
- Design And Prototype Construction Of Sorting Table
2005-3000Description: Design and Prototype Construction of Sorting Table, Franchise Tax Board, California
- Development Of Business Continuity Plan, Sjsu Foun
2005-3000Description: Development of Business Continuity Plan, SJSU Foundation
- Development Of Cost/Benefit Analysis Methodologies
2005-3000Description: Development of Cost/Benefit Analysis Methodologies for Hazard Mitigation Projects, Federal Emergency Management Agency
- Development Of Guide Wires For Angioplasty, Advanc
2005-3000Description: Development of Guide Wires for Angioplasty, Advanced Cardio-vascular Systems, Inc.
- Development Of Processing Techniques For Advanced
2005-3000Description: Development of Processing Techniques for Advanced Thermal Protection Materials, NASA-Ames Research Center, Thermal Protection Materials Branch
- Disaster Resistant California Conference, Fema
2005-3000Description: Disaster Resistant California Conference, FEMA
- Earthquake Caused Hazardous Materials Incidents, U
2005-3000Description: Earthquake Caused Hazardous Materials Incidents, U.S. Department of Interior, U.S. Geological Survey
- Earthquake Hazard Mitigation, California Office Of
2005-3000Description: Earthquake Hazard Mitigation, California Office of Emergency Services
- Earthquake hazard mitigation
2005-3000Description: null
- Effect Of Geometry On Solder Joint Reliability For
2005-3000Description: Effect of Geometry on Solder Joint Reliability for Leadless Leadframe Packages, National Semiconductor Corporation
- Effect Of Processing Parameters On Strength Of Sil
2005-3000Description: Effect of Processing Parameters on Strength of Silicon Dies, LSI Logic, Inc.
- Effect Of Thermal Processing On Microstructure Of
2005-3000Description: Effect of Thermal Processing on Microstructure of Ball Grid Arrays, Solectron Corporation
- Evaluation Of Sterilization Techniques, Guidant Co
2005-3000Description: Evaluation of Sterilization Techniques, Guidant Corporation
- Extraction Table Design And Prototype Development,
2005-3000Description: Extraction Table Design and Prototype Development, Franchise Tax Board
- Field Emission Breakdown Of High-Voltage Insulatio
2005-3000Description: Field Emission Breakdown of High-Voltage Insulation Devices, Communications & Power Industries, Inc.,
- Fluxless Soldering For Microelectronic Packages, S
2005-3000Description: Fluxless Soldering for Microelectronic Packages, Solectron Corporation
- Fracture and failure analysis
2005-3000Description: null
- Hazard Mitigation Implementation For Small Busines
2005-3000Description: Hazard Mitigation Implementation for Small Businesses, FEMA
- Hazardous Materials Incidents During Earthquakes:
2005-3000Description: Hazardous Materials Incidents During Earthquakes: Japan's Experience and Solutions, National Science Foundation
- Homeowners Guide To Seismic Safety, California Sei
2005-3000Description: Homeowners Guide to Seismic Safety, California Seismic Safety Commission
- Inventory Of Soft First Story Multi-Family Dwellin
2005-3000Description: Inventory of Soft First Story Multi-Family Dwellings in Santa Clara County, Santa Clara County, Emergency Preparedness Council
- Investigation Of Solder Mask Cracking, Lsi Logic
2005-3000Description: Investigation of Solder Mask Cracking, LSI Logic
- Magnetic Recording Head Contamination Research, Ak
2005-3000Description: Magnetic Recording Head Contamination Research, Akashic Memories Corporation
- Nonstructural Earthquake Hazard Mitigation, Califo
2005-3000Description: Nonstructural Earthquake Hazard Mitigation, California Emergency Medical Services Agency
- Nonstructural Earthquake Hazard Mitigation, Emerge
2005-3000Description: Nonstructural Earthquake Hazard Mitigation, Emergency Medical Services Agency, California
- Nsf Instrumentation And Laboratory Improvement Pro
2005-3000Description: NSF Instrumentation and Laboratory Improvement Program in Microprocessor and Intelligent Control Applications (Co-Principal Investigator), National Science Foundation
- Packaging Of Microelectronic Devices: Short Cours
2005-3000Description: Packaging of Microelectronic Devices: Short Courses for Undergraduate Faculty Enhancement, National Science Foundation
- Radio Frequency Vapor Deposition Of Diboride Compo
2005-3000Description: Radio Frequency Vapor Deposition of Diboride Compounds on Ceramic Fibers, NASA-Ames, Thermal Protection Materials Branch
- Recyclability Of Multi-Material Durable Goods, Ci
2005-3000Description: Recyclability of Multi-Material Durable Goods, City of San Jose
- Recycled Glass: Development Of Market Potential,
2005-3000Description: Recycled Glass: Development of Market Potential, City of San Jose
- Recycled Glass: Process Development For Sintered
2005-3000Description: Recycled Glass: Process Development for Sintered Glass Architectural Tiles, City of San Jose
- Screen Printing Of Wafer Level Underfill, National
2005-3000Description: Screen Printing of Wafer Level Underfill, National Semiconductor Corporation
- Signal Speed Comparison Of Flip-Chip And Wire-Bond
2005-3000Description: Signal Speed Comparison of Flip-Chip and Wire-Bonded Multichip Modules, Lockheed Corporation
- Sol-Gel Synthesis Of Borosilicate Glass, Ishm Educ
2005-3000Description: Sol-gel Synthesis of Borosilicate Glass, ISHM Educational Foundation
- Surface science and engineering
2005-3000Description: null
- Thermal Conductivity Of Interlaced Two Phase Syste
2005-3000Description: Thermal Conductivity of Interlaced Two Phase Systems for Fusible Heat Sink Applications, NASA-Ames, Life Sciences Division
- Tingle Table Ii Construction, Franchise Tax Board
2005-3000Description: Tingle Table II Construction, Franchise Tax Board
- Tingle Table Ii Construction, Franchise Tax Board
2005-3000Description: Tingle Table II Construction, Franchise Tax Board
- Utilization of Pb-free solders in microdevices
2005-3000Description: null
- Utilizing Relational Databases For Materials Prope
2005-3000Description: Utilizing Relational Databases for Materials Properties, WhoWhere, Inc.
- Wire Bond Integrity For Fine Pitch Devices, Nation
2005-3000Description: Wire Bond Integrity for Fine Pitch Devices, National Semiconductor Corporation